LCR Embedded Systems AoC3U-1440 ChassisHigh Performance Computing with Advanced Thermal Management and  Mission Configurable Backplane

Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. It features dual 9 slot backplanes including PSU slots. Backplanes are 100% configurable using Meritec cabling allowing the system to serve as a test platform or a deployable system using cable locking rails. Backplane profiles can support VPX and SOSA aligned module profiles for high-speed signal processing applications. Custom I/O panels support any application. The MIL-STD -1275 and 704 power supplies ensure continuous operation in demanding air, land and sea applications where power and environmental challenges exist. High cfm fan banks provide forced air cooling to widely available VITA 48.2 conduction cooled board sets with aggregate power demands approaching 850W, ambient environment dependent. This precision engineered packaging solution is intended for mission critical defense applications and is designed to meet a wide range of MIL-STD-810H requirements and test methods.

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  • Custom topologies supporting your payload module profiles
  • Support for 1000BASE-BX, 1000BASE-KX, 10GBASE-KX4, 10GBASE-KR, or 40GBASE-KR4
  • Up to 18 payload slots with VITA 66 and 67 Optical and RF support including VITA 62 power slots
  • Conduction cooled with forced air assist
  • Cooling for aggregate payload power approaching 1000W
  • Side walls form enclosed air chambers isolated from the modules
  • Custom backplanes support VITA 62 pluggable power supplies
  • Total power depended on payload requirements
  • Dimensions: 10.73” H (plus optional .25” mounting feet) 11.97″ (W) x 21.37 (D) plus handles)
  • Weight approximately 60lbs including typical payload
  • Application driven custom I/O panels with MIL-STD connectors
  • VITA 48.2 conductive cooling with air assist
  • Designed to meet a variety of MIL-STD-810H and MILSTD-461 methods


Bridging the cooling gap in high-speed embedded systemsInterested in learning more about thermal management?

Read the article Bridging the Cooling Gap in High-Speed Embedded Systems

Watch the webinar Driving the Heat Out of Embedded Military Systems