Bridging the cooling gap in high-speed embedded systemsIn the high-performance world of VPX for defense applications, aggregate payload power calls for creative strategies when addressing cooling at the chassis level as well. New high-performance applications will demand new inventiveness, if not outright new inventions, in applying and adapting established chassis-level cooling techniques while keeping costs down. Properly engineered VITA 48.2 chassis using air or liquid assist are capable of cooling payloads far more effectively compared to conduction-cooled-only chassis. These design extensions for 3U and 6U systems enable cost savings in applications which can support air and liquid cooling by leveraging a well-established VITA 48.2 supplier ecosystem.

Steve Gudknecht, Product Marketing and Communications Manager, and Jordan Sudlow, Mechanical Design Engineer, discuss new chassis-level cooling techniques for VITA 48.2 chassis using air or liquid assist in this article with Military Embedded Systems.


Interested in learning more about thermal management? Watch the webinar Driving the Heat Out of Embedded Military Systems, hosted by Military Embedded Systems magazine