Heat dissipation in embedded systems, especially in rugged VPX based installations is a key focal point in any chassis design. Thermal management is a top priority at LCR and SOLIDWORKS Flow CFD (Computational Fluid Dynamics) is used to evaluate and optimize the thermal capabilities and limits of every chassis we design. We analyze the behavior of the design under adverse temperatures and thermal load conditions, checking for hot spots and seeking areas of improvement. LCR is a recognized leader in conduction cooled, air cooled and hybrid air and liquid cooled chassis solutions for 3U VPX , 6U VPX and SOSA architecture systems.
Engineering Design
Engineering Design
At LCR, we take a holistic approach to system design, addressing every aspect from packaging and signal flow analysis to power envelope, thermal management, I/O requirements, and payload integration. Our team applies decades of experience to the development of rugged deployment enclosures, high-speed backplanes, and development chassis for mission-critical defense applications. We specialize in VPX and SOSA system designs in accordance with MOSA principles as well as legacy system designs for VME and ATCA based systems.
Supporting New Program Designs
Our engineers are established in a variety of disciplines including electrical, mechanical, software, test and systems engineering. We combine experienced leadership with fresh perspectives and new ideas to form a knowledgeable and engaging staff ready to assist our customers from initial requirements review through all stages of solution realization, manufacturing and post deployment support. For decades, US DoD programs have learned to rely on LCR.
Design Tools and Expertise
We use leading edge design tools to ensure optimal results and to provide a comprehensive overview of the desired system.
High shock and vibration are the norm in rugged defense applications and the structural integrity of any packaging solution is crucial to protecting mission critical electronics. Our experts use SOLIDWORKS Simulation to zero in on the stresses and strains of packaging under internal and external loads. SOLIDWORKS helps to reduces costs and the need for rework during the development phase. Optimization is achieved through analyzing the behavior of the design under adverse static and dynamic load conditions.
SOLIDWORKS is employed throughout the chassis mechanical and electrical design process starting with initial planning, detailed visual conceptualization, feasibility review, modeling and creating prototypes. 2D parametric based drawing creation using DXF, DWG, STEP, IGES, STL and other file formats.
3D printing has come increasingly into use in the manufacturing sector. At LCR, we’ve been employing and honing our skills in 3D printing for years. Using in-house equipment, we create engineering models, prototypes, production components, connectors, tooling and fixtures to support our designs beginning from the early development stages. Liquid cooled chassis often require intricate fluid paths that benefit from the precision of 3D printing. Our engineers are experienced in the use of leading edge printers and various high strength materials onyx, fiberglass, Kevlar and carbon fiber.
Extensive test plans are created to verify every step of a design meets pre-determined specifications and performance goals. DVT testing may include some or all of the following:
- Power Load Testing
- Functionality Testing
- Continuity Testing
- Mechanical Fit Verification
- Thermal / Airflow Testing
- Signal Integrity Testing
- Temperature Testing
- Environmental Testing
- Shock Testing
- Vibration Testing
- EMI Testing
MIL-STD testing at LCR is standard procedure. Our off the shelf and custom packaging solutions are subjected to a range of testing methods to your meet your application specific requirements.
- Vibration Testing
- MIL-STD-810
- MIL-STD-167-1 (shipboard
- Shock Testing
- MIL-STD-810
- MIL-STD-901 (shipboard)
- EMI Testing
- MIL-STD-461 – Conducted and Radiated
- Temperature Testing
- MIL-STD-810
Supporting 100Gb Ethernet and PCIe Gen 4 Protocols
LCR Embedded Systems offers advanced VPX backplane design capabilities optimized for high-performance, SOSA-aligned architectures. Our engineering team leverages decades of experience to ensure signal integrity across complex high-speed interconnects supporting data rates up to 100Gb. Using advanced testing methods such as eye-diagram analysis, time-domain reflectometry (TDR), and crosstalk modeling, LCR ensures reliable signal performance and compliance with VPX and SOSA requirements. Each design is tailored to meet demanding defense and aerospace applications, balancing power, thermal, and data path considerations for optimal system performance in rugged environments. LCR’s backplanes form the foundation of reliable, mission-ready embedded computing systems.
LCR engineering teams are located in both our Auduban, PA and Jackson, MS offices.
Contact Us Today
Our headquarters, engineering center, customer support center and manufacturing facility is located in Audubon, PA. just minutes from Center City Philadelphia. Our design facility in Ridgeland, MS. provides additional engineering resources in board design and system integration.