The CompactPCI standard was created to address a large range of applications, including aerospace and defense as well as communications and industrial. The standard supports both 3U and 6U cards and allows for both convection (air) and conduction cooling. Since its release in 1995, it has also been extended multiple times. Most deployments are in communications, with aerospace and defense in second place.
As a telecom-focused standard, CompactPCI enjoys moderate cost-effectiveness for applications requiring lower-intensity processing, and the 3U card size system offers excellent size, weight, and power (SWaP) advantages. The PCI architecture also supports a variety of I/O.
- Standard and custom sizes
- 2 through 8-slot configurations
- 3U and 6U monolithic boards
- Outer Ground Layers for EMI/RFI Shielding
- Heavy plated contacts for longer life and robustness
- Rear power studs, 10-pin power bugs or connectors
- Designed and fabricated to commercial standards, MIL-P-5510, IPC 600, MIL-Prf-31032 and MIL-P-23200
- High Performance, Low Noise
- Operating Temperature: -40° C to +85° C
- Storage Temperature: -55° C to +85° C
- Hot Swap Compatible
- 32-bit or 64-bit designs
- 33 MHz and 66 MHz designs
- Three front power connector configurations (47 pin, 38 pin or M-Style)
- Custom slot configurations
- Custom board sizes
- Up to 32 layers
- Multiple layer controlled impedance design