LCR Embedded Systems' AdvancedTCA Backplanes

Standard and Custom AdvancedTCA Backplanes

AdvancedTCA is an excellent technology for deployments requiring high-speed, high-performance computing and offers the added cost advantages that come with using a commercially popular and widely used telecommunications form factor.

We design our AdvancedTCA backplanes to function as part of a comprehensive, rugged enclosure ecosystem, with extended real estate to facilitate the connection of fan trays and power supplies, making major components pluggable and modular and eliminating unnecessary parts, components, assembly time, and additional manufacturing steps.

  • Compliant to PICMG 3.0, Rev 3.0
  • Mesh, Star and Dual Star Fabric Topology
  • Bussed or Radial IPMI
  • Standard and Custom Sizes
  • High Speed, High Performance, Low Noise
  • Operating Temperature: -40° C to +85° C
  • Storage Temperature: -55° C to +125° C
  • Standard Slot Configurations 3, 4, 5, 6, 7, 9 and 14
  • 2 Hub Slots and up to 12 Node Slots
  • Pluggable Shelf Managers, Fan Trays and Power Entry Modules (PEMs)
  • Outer Ground Layers for EMI/RFI Shielding
  • 2 to 16 Slot Configurations
  • 2 Hub Slots and up to 14 Node Slots or Custom Configuration
  • Custom Interface for Shelf Managers, Fan Trays, and Power Entry
  • Designed and Fabricated to Commercial Standards, MIL-P-5510, IPC 600, MIL-PRF-31032
  • Controlled Impedance Stripline Design
  • Complete Eye Chart Testing Available
  • Outer Ground Layers for EMI/RFI Shielding