As the demands for high-performance computing in mission-critical defense and aerospace applications continue to grow, the need for seamless integration, faster connectivity, and rugged reliability in embedded systems increases. VPX technologies have long been at the forefront of complex embedded computing, where various systems and components need to work cohesively.
VPX (VITA 46) has been around since the 2000s, and as the successor to VME, it was developed to meet the higher performance demands of mission-critical applications. After multiple revisions, VPX/ SOSA systems have gained traction over recent years and become de facto requirements for current and future systems.
Streamlining Integration with VPX Development Chassis
In its simplest form, a VPX development chassis can be used to test and develop single boards, so manufacturers can simply plug one card into the system for test and debug access, for example. This provides easy swapping and reconfiguration of boards in an open platform chassis. However, the majority of VPX development chassis are used for larger system development that mandates the need for a backplane.
The foundational purpose of a VPX development chassis is to enable the user to create the map of the data flows, or the profile (as it’s known), of the intended application, and it’s crucial to have an environment that allows for the testing and integration of VPX-compliant hardware. The unit acts as a flexible, testable, and adaptable platform that streamlines this process and reduces the time and cost associated with design and integration.
The backplane serves a critical function in application development, connecting all the boards within the chassis to enable high-speed communication and power delivery so all the boards to communicate at the highest levels of signal integrity. (Figure 1)
Connectivity through Cabling
In deployed VPX / SOSA systems, the backplane provides high-speed connectivity between all the boards in the system.
However, since no 2 VPX backplanes are exactly alike, off the shelf products with the required profile are typically not available. For that reason, in the development phase using a development chassis, backplane cabling solutions may be used to provide slot to slot connectivity between boards (boards are also referred to as VPX modules or plug in cards or PICS). Cabling systems allow the developer to create the desired profile without committing to the expense of a custom backplane which may prove to have data flow errors. (Figure 2)
To support customers during the various stages of development, LCR provides VPX / SOSA development chassis with backplanes designed for power and ground connectivity only. P and G backplanes enable use of the cabling system from Meritec to create the profile and address I/O signal requirements. This allows iterative backplane profile testing and modification that eventually leads to the desired profile for the application.
3U vs. 6U VPX: What’s the Right Choice?
3U module usage outpaces 6U modules by more than 10 to 1, and at LCR development chassis are available for both module sizes
The versatile, and more predominant, 3U VPX (100 x 160mm) makes it both lightweight and compact, perfect for systems where space is at a premium and applications processing at the edge. 6U VPX (233.35 x 160mm), in contrast, provides more space for connectors, higher powered processing units, and other components. (Figure 3) While the both 3U VPX and 6U VPX modules utilize AI and GPGPU processing to take on processing at the edge, complex and power-intensive tasks, the 6U VPX’s larger size allows for more functionality.
LCR’s wide range of VPX development chassis meets these diverse needs of system engineers. This includes the DK3HS-4, a 4-slot system that supports 100Gb data rates (25 Gb per lane) with a more compact and lighter weight than other DK3HS models, but just as cost-effective. It is ideal for testing and integration of new and emerging 3U VPX, OpenVPX and SOSA aligned plug in cards (PICs) in systems with lower slot counts.
The DK6, an Open Frame 6U VPX Development Platform, features an open frame concept and enhanced flexibility with simple conversion between air and conduction cooled module guides and fast backplane replacement for easy reconfiguration to support every stage of development.
LCR also designs and builds off-the-shelf and custom high-speed 3U and 6U VPX backplanes that provide rugged, high-performance solutions tailored to diverse defense and aerospace requirements, while supporting new and emerging SOSA aligned slot profiles.
Meeting Payload Power with Cooling Capabilities
The massive payload power of today’s embedded VPX systems calls for creative strategies when addressing cooling at the chassis level. This will only increase as the demand for high performance systems in EW, RF, SIGINT and radar applications grow. It’s not uncommon for current development chassis to accommodate multiple boards, each drawing up to 100 W – or more – of power.
While the methods employed to mitigate the heat generated, such as conduction-cooled (VITA 48.2), is handling the cooling needs of today’s systems, dissipating the growing amount of heat within embedded systems is becoming the reality, bringing liquid cooling into the equation. Next steps in development chassis solutions will inevitably offer an expanded set of cooling options for the increasing power requirements of high density, compact VPX systems.
Ensuring Efficient Application Development
A development chassis for VPX (and SOSA aligned) payloads will help to fast-track the application design cycle, providing easy configuration and testing as well as a wide variety of I/O capabilities. Versatile 3U and 6U test and development beds support air- and conduction-cooled modules and a range of different power requirements. Whether its initial concept, custom backplane profile design or the manufacture, integration and test of the final deployed chassis, LCR is equipped to support your application development efforts.
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