Conduction Cooled Chassis from LCR Enhances Heat Dissipation Capability for SOSA Aligned and VPX Module Payloads

LCR AoC3U-400 series of ATR chassis for SOSA Aligned and VPX Module Payloads

Conduction Cooled Chassis from LCR Enhances Heat Dissipation Capability for SOSA Aligned and VPX Module Payloads The AoC3U-400 Series helps maintain safe operating temperatures Technical Highlights: Conduction cooled ATR chassis with air assist VITA 48.2 3UVPX and SOSA aligned module payloads Custom 4 slot backplanes, VITA 62

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Single Slot VPX Packaging from LCR for Sensor and High-Speed Computing Applications

LCR AoC3U-100 single slot VPX chassis

LCR Embedded Systems has released a new rugged, single slot packaging solution designed for 3U VPX and SOSA aligned payload cards supporting high-speed connectivity with RF, GbE, 10GbE and optical interfaces. The AoC3U-100, part of LCR’s air over conduction cooled (AoC) chassis line, addresses a wide range of EW / ISR and radar uses in both ground and airborne assets where size constraints and functional performance are key.

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VPX Open Frame Development Chassis from LCR Offer Unmatched Configuration Flexibility for Fast Development Cycles

DK3 Open Frame 3U VPX Development Platform

DK3 and DK6 pave the way towards fast VPX system deployment Technology Highlights: Open access design with a carrying handle Quick-conversion air or conduction cooled slot inserts Fast and easy backplane conversion .8″, 1.0″ and 1.2″ slot pitch options Adjustable speed high cfm fans Range of backplane

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