Webinar with LCR Embedded Systems:
Packaging AI and Edge Computing for the
Rugged Environment of the Battlefield
When: April 22, 2025
Time: 2pm ET
Hosted By: Military and Aerospace Electronics
Speaker: Bill Pilaud, Chief Solutions Architect, LCR Embedded Systems
Artificial intelligence (AI) computing is a core technology thrust for the U.S. military and its allies, and much research is going into emulating human reasoning in computer hardware and software. Packaging design and integration of VPX and SOSA aligned systems for AI must consider extreme conditions of shock, vibration and temperature and ensure the highest levels of signal integrity in the system backplane and custom I/O panel design.
Listen as Bill Pilaud from LCR discusses rugged packaging and system integration considerations for AI computing applications in demanding battlefield conditions on land, air and the sea.
Co-Speakers:
Justin Moll, Vice President, Sales and Marketing, Pixus Technologies
Dominic Perez, Chief Technology Officer, Curtiss-Wright Defense Solutions
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