Perfect for UAVs, Ground Mobile

Perfect for data-intensive sensor applications.

Perfect for data-intensive sensor applications.

Designed in collaboration with industry leader ADLINK, and featuring ADLINK processor blades and Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conduction-cooled, featherweight 3-Slot VPX System breaks new ground in addressing the concerns of UAV application developers and allows for the massive expansion of payload performance and processing power for autonomous vehicles.

While the system has been designed around ADLINK’s VPX3xxx series processor based on the Intel® Xeon® D and VPX3G10 Graphics Processing Unit, other processor cards, GPUs, and more can be used if the customer prefers.

  • Ideal for small UAVs, man-pack, ground mobile
  • 3-Slot VITA 48.2 VPX featuring superior cooling and processing
  • Super-efficient chassis design
  • Available in multiple configurations for demanding sensor management applications
  • Supports high-speed signaling
  • Optional MIL-STD-1553 XMC card for communication with avionics bus
  • Removable SSD hard drive
  • Input power compliant to MIL-STD-704/MIL-STD-1275 (voltage spikes, cranking level 18V min.)
Input Power:

  • Nominal Input Voltage: +28 VDC
  • Input Transients: MIL-STD-704F
  • Max Power Consumption: 175W

Output Power:

  • Backplane: 12/5/3.3 V, ±12/3.3Vaux
  • Regulation: ANSI/VITA 62


  • 2 3U VPX, 1 3U VITA 62 power supply


  • ANSI/VITA 46.0, ANSI/VTA 65-2010
  • Various payloads available, but may require custom backplane to accommodate different slot profiles
  • Dimensions: 5.40” (H) x 7.15” (W) x 10.53” (D)
  • Weight: 12lb fully populated including SSD
  • Mounting: Provided to secure chassis to a flat metal surface
  • Operating/Storage Temperature: -40 to 50 C/-50 to 100 C, Designed to MIL-STD-810G Method 501.5, Procedure II
  • Thermal Shock: Designed to MIL-STD-810G, Method 503.5, Procedure I
  • Humidity/Altitude: 0 to 95% noncondensing/60,000’
  • Shock/Vibration: Designed to MIL-STD-810G, 40G
  • Sealing: IP67
  • Method: Conduction cooling through baseplate and natural convection
  • Dissipation: Thermal loads up to 175W