Airborne/Shipboard/Ground Mobile, High-Speed Backplane
Design in accordance with PICMG 3.0, rugged and reliable
Designed in accordance with PICMG 3.0, this chassis is sturdy, efficient, and designed to support your most environmentally demanding mission-critical military applications.
- Shelf/Chassis Management: Vadatech or Pigeon Point based shelf manager
- Options: Rackmount slides, conformal coating, DC input
- Customizations: Slot count, cooling, orientation, MIL-STD-461
- Accessories: Air filter, filler panels
- Fan tray easily removed for maintenance and repair
- Rackmount with rear shock pins or bench-top
- Accepts two shelf managers which can be supplied with the chassis
- Form factor: AdvancedTCA
- Card size: N/A
- Fabric/Profile: Dual Star bussed IPMB
- Slot count: 14
- Method: Convection, bottom to top
- Fans: 6 Front, 224 CFM each
- Watts per slot: 225W
- Monitoring/Control: Monitoring, Control via PWM
- I/O: IPMI
- Switches: ON/OFF/RESET
- Indicators: Critical, Major, Minor
- Input power: -48 VDC, 100 A A/B bus
- Filtering: None
- Breaker/Fuse: 100 A circuit breaker per bus
- Intelligence: N/A
- HWD: 13U x 19″ x 15.7″
- Weight: 52 lb
- Materials: Aluminum frame
- Construction: Bolted sheet metal, machined frame
- Finish: Exterior Surfaces powerdercoat, Interior Surfaces chemical conversion IAW MIL-DTL-5541 Type II Class 3
- Temperature: -10C to 60C (op), -40C to 70C (st)
- Humidity: 5-95% (op), 10-95% (st)
- Altitude: 15,000 ft
- Shock: 20Gs @ 11ms MIL-STD-810E Method 516.4
- Vibration: MIL-STD-810G Method 514.6 Procedure I
- EMI: None
- IP Rating: None
